Products
Semiconductor Materials
High-purity, high-reliability materials for fabs and packaging.
Process & Packaging Materials
| Product | Specification | Application | Origin | |
|---|---|---|---|---|
| High-Purity Quartz Components | SiO₂ ≥ 99.99% | Wafer fabrication | Japan | Inquire |
| Epoxy Molding Compound | Low CTE, low α-particle | IC packaging | Japan | Inquire |
| Underfill Material | Capillary flow, fast cure | Flip-chip packaging | USA | Inquire |
| Cleanroom Functional Coating | Anti-static, low outgassing | High-cleanliness equipment | Germany | Inquire |